Material Characteristics:
High-purity alumina micro-powder is used as the raw material, with purity ranging from 95% to 99.9%. Through batching, forming, and densification sintering in a high-temperature air atmosphere furnace, high-performance alumina ceramic materials can be obtained, featuring density of 95%–99.9% or higher, uniform microstructure, and no free impurity residues. The material exhibits high hardness, high wear resistance, good electrical insulation, excellent high-temperature strength, and thermal shock resistance.
Product Information:
Alumina ceramic substrates are made from high-purity alumina through tape casting or isostatic pressing and high-temperature sintering. They are used as insulating supports and heat dissipation substrates for electronic components, providing a mounting platform with high flatness, high insulation, and good thermal conductivity. The substrates possess high strength, thermal shock resistance, and good chemical stability. During long-term use, they do not deform or precipitate impurities, ensuring reliable circuit performance.
Performance Parameters：
| 95% (Al₂O₃≥95%) | 99% (Al₂O₃≥99%) | 99.5% | 99.9% |
Density (g/cm³)： | 3.70–3.75 | 3.85–3.90 | 3.90–3.93 | 3.95–3.98 |
Flexural Strength (MPa)： | 250–350 | 300–400 | 350–450 | 400–550 |
Compressive Strength (MPa)：
| 2000–3000 | 2500–3500 | 2800–3800 | 3000–4000 |
Fracture Toughness (MPa·m¹/²) | 3–4 | 3.5–4.5 | 4–4.5 | 4–5 |
Mohs Hardness： | 8.5–9 | 9
| 9 | 9 |
Elastic Modulus (GPa)： | 300–350 | 350–380 | 370–390 | 380–400 |
Volume Resistivity (Ω·cm) @25°C： | >10¹⁴ | >10¹⁴ | >10¹⁵ | >10¹⁶ |
Maximum Operating Temperature (°C) (long term)： | 1400–1500 | 1550–1650 | 1650–1700 | 1700–1750 |
Dielectric Strength (kV/mm)： | 12–16 | 15–20 | 18–22 | 20–25 |
Thermal Conductivity (W/(m·K)) @25°C： | 20–25 | 28–32 | 30–35 | 35–40 |
Product Dimensions:
Standard substrate thicknesses range from 0.25 mm to 2.0 mm, and length and width dimensions can be cut according to customer requirements, with a maximum producible size exceeding 200 mm × 200 mm. The products can undergo processing such as single/double-sided precision grinding, polishing, laser cutting, scribing, drilling, and surface metallization. Yuko Corporation can also customize non-standard thicknesses, special-shaped substrates, copper-clad ceramic substrates, and substrates with cavities according to customer drawings.
Product Applications:
Alumina ceramic substrates are widely used in thick-film circuits, thin-film circuits, chip resistors, LED heat dissipation substrates, semiconductor power device packaging, sensor bases, microwave and RF circuits, and hybrid integrated circuits. They are a key insulating and heat-dissipating base substrate in the electronics industry.