Material Characteristics:

Pressureless sintered silicon carbide (S-SiC) is made of high-purity silicon carbide (SiC) micropowder as raw material. After forming by dry pressing, slip casting or isostatic pressing, densification sintering is conducted in a high-temperature furnace under atmospheric pressure and inert gas protection at a sintering temperature of about 2100-2200℃. This process can produce high-performance ceramics with a theoretical density of over 98%, uniform microstructure and no free silicon residue. The product features extremely high hardness, excellent corrosion resistance, oxidation resistance and wear resistance, and is widely used in industrial kilns, electronic materials, semiconductors and other industries.

Product Information:

Pressureless sintered silicon carbide (S-SiC) carrier plate adopts cold isostatic pressing process combined with high-temperature pressureless sintering technology, or high-flatness blanks are prepared by large-size extrusion molding followed by densification sintering. It ensures uniform overall density distribution, high surface flatness and excellent edge straightness of the plate. Featuring no bending, no delamination, high thermal shock stability and minimal deformation under long-term high-temperature service and large-area load-bearing conditions, it serves as an ideal large-plane support and flame isolation component in high-temperature kilns.

Performance Parameters:

Bulk density ≥ 3.10 g/cm³, apparent porosity ＜ 0.1%, cold bending strength ≥ 400 MPa, maximum service temperature 1650℃.

Product Dimensions:

Conventional S-SiC carrier plate covers a length range from 200mm to 1500mm, width from 150mm to 600mm and thickness from 5mm to 30mm. Secondary processing is available, including single/double-sided precision grinding, four-edge finishing, positioning drilling, step milling, tenon and groove processing, and threaded hole machining. Yuko Corporation can also provide customized products according to customers’ drawings, special profiles and customized flatness requirements.

Product Applications:

S-SiC carrier plate is widely used as shelf plates and partitions for laminated sintering of electronic ceramics, load-bearing platforms for high-temperature sintering furnaces of powder metallurgy and magnetic materials, furnace bottom partitions and flame baffles for lithium battery cathode and anode material roller kilns, lining support plates of high-temperature electric furnaces, and wafer bearing bases for semiconductor heat treatment equipment. It acts as the core firing, support and tooling component under large-area, high-temperature and heavy-duty working conditions.